Resonant frequency tag and method for controlling tag frequency

ABSTRACT

A method of making a resonant frequency tag which resonates at a predetermined frequency comprises the steps of forming a first conductive pattern comprising an inductive element and a first land, the first land having a first end connected to one end of the inductive element, and a second end spaced a predetermined distance from the first end; separately forming a second conductive pattern comprising a second land and a link element, the second land having a predetermined width; placing the second conductive pattern proximate to the first conductive pattern at a first predetermined location so that the second land overlies at least a portion of the first land with a dielectric therebetween to establish the plates of a capacitive element with a first predetermined capacitance which with the inductive element forms a resonant circuit; measuring the resonant frequency of the resonant circuit and comparing the measured frequency with the predetermined frequency; if the resonant frequency does not match the predetermined frequency within a selected tolerance, moving the second conductive pattern so that the second land moves along the length of the first land to thereby change the capacitance of the capacitive element; repeating the last two steps until a match occurs; and securing the second conductive pattern to the first conductive pattern.

BACKGROUND OF THE INVENTION

The present invention relates generally to resonant frequency tags and,more particularly, to a method for making such resonant frequency tagsto provide for improved control of the resonant frequency of such tags.

Resonant frequency tags are tags which include a passive electricallyresonant frequency circuit which resonates at a predetermined frequencywhen stimulated by a radio frequency electromagnetic field at about theresonant frequency of the tag and which is incident upon the tag. Aresonant frequency circuit resonating within a region occupied by suchan electromagnetic field perturbs the electromagnetic field. Theperturbation of the electromagnetic field is detectable by suitableequipment. Consequently, the presence of a passive resonant frequencytag within a prescribed region may be detected.

Typically, resonant frequency tags are attached to or embedded withingoods sold at retail or to the packaging for such goods in order todeter or detect theft. Resonant frequency tags used for this purpose arecapable of being removed from the goods or deactivated when a legitimatesale is consummated. Resonant frequency tags which are not removed ordeactivated at the point of sale may be detected by suitable detectionapparatus generally placed at points of exit from a retail or otherestablishment. Such resonant frequency tags may have other usesincluding for identification or information purposes, such as a radiofrequency identification (RFID) tag which may or may not include anintegrated circuit or chip.

Typically, a resonant frequency tag comprises a generally flat thinlaminate of a dielectric layer separating two conductor layers.Typically, one of the conductor layers comprises a flat spiral conductor(coil) forming an inductor, and a land forming one plate of a capacitorwhich is connected to a proximal end of the coil. A second land forminga second plate of the capacitor is formed as the second conductor layer.A through connection between the second plate and a distal end of thecoil completes the resonant frequency circuit comprising the coilinductor connected parallel with the capacitor.

It is required that the inductive and capacitive elements of resonantfrequency tags be manufactured with some precision in order that theresonant frequency of the tags be held within prescribed limits of thedetection apparatus. A generally used method for making resonant tagsemploys etching a metallic foil to form the components of the conductivelayers.

The manufacturing techniques employed in producing the prior art andcurrent resonant frequency tags results in some unwanted variability inthe final tag frequency. The unwanted variability is generally theresult of small changes in the value of the capacitive element whichvary from resonant circuit to resonant circuit during the productionprocess. Such variations in the value of the capacitive element may bedue to several factors, including irregularities in the dielectric areabetween the plates of the capacitor. The present invention comprises amethod for compensating for variations in the manufacturing process toproduce resonant frequency tags with a more consistent resonantfrequency.

BRIEF SUMMARY OF THE INVENTION

Briefly stated, in one embodiment, the present invention comprises amethod of making a resonant frequency tag which resonates at apredetermined frequency. The method comprises the steps of forming afirst conductive pattern comprising an inductive element and a firstconductive land, the first land having a first end connected to one endof the inductive element, and a second end spaced a predetermineddistance from the first end; separately forming a second conductivepattern comprising a second land and a link element, the second landhaving a predetermined width; placing the second conductive patternproximate to the first conductive pattern at a first predeterminedlocation so that the second land overlies at least a portion of thefirst land with a dielectric therebetween to establish the plates of acapacitive element with a first predetermined capacitance which with theinductive element forms a resonant circuit; measuring the resonantfrequency of the resonant circuit and comparing the measured frequencywith the predetermined frequency; if the resonant frequency does notmatch the predetermined frequency within a selected tolerance, movingthe second conductive pattern so that the second land moves along thelength of the first land to thereby change the capacitance of thecapacitive element; repeating the last two steps until a match occurs;and securing the second conductive pattern to the first conductivepattern.

In another embodiment, the present invention comprises a method ofmaking a series of resonant frequency tags which each resonate at apredetermined frequency, the method comprising the steps of forming aseries of first conductive patterns, the first conductive patterns allbeing substantially the same, each first conductive pattern comprisingan inductive element and a first conductive land, the first land havinga first end connected to one end of the inductive element and a secondend spaced a predetermined distance from the first end; separatelyforming a series of second conductive patterns, the second conductivepatterns all being substantially the same and each second conductivepattern comprising a second conductive land and a link element, thesecond land having a predetermined width; securing a second conductivepattern to a first conductive pattern of the series at a firstpredetermined location so that the second land overlies at least aportion of the first land with a dielectric therebetween to establishthe plates of a capacitive element of a first tag of the series, thecapacitive element having a first predetermined capacitance; measuringthe resonant frequency of the tag and comparing the measured frequencywith the predetermined frequency; if the measured resonant frequencymatches the predetermined frequency within a predetermined tolerance,securing a second conductive pattern to a subsequent first conductivepattern of the series at the first predetermined location so that thesecond land overlies at least a portion of the first land with adielectric therebetween to establish the plates of a capacitive elementof a subsequent tag, the capacitive element having the firstpredetermined capacitance and then repeating the prior and present stepsfor the remainder of the series and if the measured resonant frequencydoes not match the predetermined frequency within the predeterminedtolerance, securing a second conductive pattern to the second surface ofa subsequent first conductive pattern of the series at a secondpredetermined location, different from the first predetermined locationso that the second land overlies at least a portion of the first landwith a dielectric therebetween to establish the plates of a capacitiveelement of a subsequent tag, the capacitive element having a secondpredetermined capacitance and then repeating the prior and present stepsfor the remainder of the series.

In another embodiment, the present invention comprises a method ofmaking a series of N resonant frequency tags with N being an integergreater than 1. Each of the N tags has a resonant frequency whichdiffers from the resonant frequency of every other tag in the series byat least a predetermined minimum frequency range. The method comprisesthe steps of forming N first conductive patterns, the first conductivepatterns all being substantially the same and each first conductivepattern comprising an inductive element and a first conductive land witha first end of the first conductive land being connected to one end ofthe inductive element and a second end of the first conductive landbeing spaced from the first end by a predetermined distance; separatelyforming N second conductive patterns, the second conductive patterns allbeing substantially the same and each second conductive patterncomprising a second land and a link element, the second land having apredetermined width; and sequentially securing a second conductivepattern to each of the first conductive patterns at a location so thatthe second land of each second conductive pattern overlies a portion ofthe first land of the corresponding first conductive pattern with adielectric therebetween to establish the plates of a capacitive elementfor each resonant frequency tag, the location of each second conductivepattern relative to the first conductive land of a corresponding firstconductive pattern and thus the amount by which each second landoverlies the first land being different for each resonant frequency tagof the series so that the capacitance of the capacitive element of eachresonant frequency tag is different from the capacitance of thecapacitive element of every other resonant frequency tag of the seriesby at least a minimum value to thereby cause each resonant frequency tagto resonate at a different frequency from every other resonant frequencytag of the series.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The foregoing summary, as well as the following detailed description ofpreferred embodiments of the invention, will be better understood whenread in conjunction with the appended drawings. For the purpose ofillustrating the invention, there are shown in the drawings embodimentswhich are presently preferred. It should be understood, however, thatthe invention is not limited to the precise arrangements andinstrumentalities shown. In the drawings:

FIG. 1 is a top plan view of a first principal surface of a typicalprior art resonant frequency tag;

FIG. 2 is a bottom plan view showing the second, opposite principalsurface of the resonant frequency tag shown in FIG. 1;

FIG. 3 is a top plan view of a resonant frequency tag produced inaccordance with the present invention;

FIG. 4 is a schematic diagram illustrating a preferred manufacturingprocess for producing resonant frequency tags of the type illustrated inFIG. 3;

FIG. 5 is a fragmentary view of a portion of an alternative embodiment;

FIG. 6 is an enlarged perspective view of a second conductive patternwhich includes an integrated circuit in accordance with anotherembodiment of the present invention.

FIG. 7 is a flow diagram illustrating a method of adjusting thefrequency of a resonant frequency tag made in accordance with thepresent invention; and

FIG. 8 is a diagram illustrating the change in frequency of a resonantfrequency circuit as a function of the thickness of the dielectricbetween the capacitor plates.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawings wherein the same reference numeraldesignations are applied to corresponding elements throughout theseveral figures, there is shown in FIGS. 1 and 2 a typical resonantfrequency tag or tag 10 of a type for use with an electronic articlesecurity system (not shown). The tag 10 is generally of a type which iswell known in the art of electronic article security systems, having twooperational states: (1) an active state in which the tag 10 isdetectable by an electronic article security system and (2) an inactivestate in which the tag 10 is not normally detectable by an electronicarticle security system. As is well known in the art, the tag 10 isadapted to be secured to or otherwise borne by or within an item orarticle, or the packaging of such article for which security orsurveillance is sought. The tag 10 may be secured to the article or itspackaging at a retail or other such facility, or as is presentlypreferred, secured or incorporated into the article or its packaging bya manufacturer or wholesaler of the article.

The tag 10 is employed in connection with an electronic article securitysystem (not shown), particularly an electronic article security systemof the radio frequency or RF type such as exemplified by U.S. Pat. No.3,863,244 entitled “Electronic Security System Having Improved NoiseDiscrimination” which is incorporated herein by reference. Suchelectronic article security systems are well known in the art andtherefore, a complete description of the structure and operation of suchelectronic article security systems is not necessary for anunderstanding of the present invention. Suffice it to say that suchelectronic article security systems establish a surveillance ordetection zone, generally proximate to an entrance or exit of afacility, such as a retail store. The function of the security system isto detect the presence within the detection zone of an article having anactive tag 10 secured thereto or secured to the article's packaging.

The security tag 10 includes components (hereinafter described ingreater detail) which establish a resonant circuit 11 which resonateswhen exposed to radio frequency RF energy at or near a predetermineddetection resonant frequency of the resonant circuit 11. A typicalelectronic article security system employing the tag 10 includes meansfor transmitting RF energy of a frequency at or near the resonantfrequency of the security tag 10 into or through the detection zone andmeans for detecting an RF field disturbance that is caused by thepresence of the security tag 10 resonant circuit 11 in the detectionzone to establish the presence of the security tag 10 and thus aprotected article, within the detection zone.

The typical tag 10, shown in FIGS. 1 and 2, comprises a generallyrectangular, planar insulative or dielectric substrate 12 having firstand second opposite principal surfaces 14, 16. The substrate materialmay be any solid material or composite structure of material so long asit is insulative and can be used as a dielectric. Preferably thesubstrate 12 is formed of an insulated dielectric material of a typewell known in the art, for example, a polymeric material such aspolyethylene. However, it will be recognized by those skilled in the artthat other dielectric materials may alternatively be employed in formingthe substrate 12.

The tag 10 further comprises circuitry located on the substrate 12 forestablishing at least one resonant circuit 11 by forming predeterminedcircuit elements or components on both principal surfaces 14, 16 of thesubstrate 12 which will be hereinafter described. The circuit elementsare formed by a combination of a first conductive pattern 18 imposed onthe first principal surface 14 of the substrate 12 best seen in FIG. 1,which surface is arbitrarily selected as the top surface of the tag 10,and a second conductive pattern 20 imposed on the opposite side orsecond principal surface 16 of the substrate 12 (best seen in FIG. 2).

The conductive patterns 18, 20 are formed on the substrate surfaces 14,16, respectively, with electrically conductive materials of a known typeand in a manner which is well known in the electronic articlesurveillance art. In one known embodiment, the conductive material ispatterned by a subtractive process (i.e. etching), whereby unwantedconductive material is removed by chemical attack after the desiredconductive material for forming the conductive patterns 18, 20 has beenprotected, typically with a printed-on etch resistant ink. A suitablemethod for forming such conductive patterns is described in detail inU.S. Pat. No. 3,913,219 entitled “Planar Circuit Fabrication Process”which is incorporated by reference. The conductive material ispreferably aluminum. However, other conductive materials (e.g., gold,nickel, copper, phosphor bronzes, brasses, solders, high densitygraphite, aluminum filled conductive epoxies or silver-filled conductiveepoxies) can be substituted for aluminum without changing the nature ofthe resonant circuit 11 or its operation. It will be appreciated bythose skilled in the art that other suitable electrically conductivematerials and/or fabrication methods could alternatively be employed.

The first and second conductive patterns 18, 20 establish a resonantcircuit 11 having a resonant frequency within the detection range of theelectronic article security system with which the tag 10 is employed. Inthe case of the tag 10, the resonant circuit 11 is comprised of a singleinductor or inductive element which is electrically connected inparallel with a single capacitor or capacitive element. As best shown inFIG. 1 the inductive element comprises an inductive coil 26 formed aspart of the first conductive pattern 18. However, it will be recognizedthat the inductive coil 26 could be formed as part of the secondconductive pattern 20, or could be formed as part of both conductivepatterns 18, 20. Alternatively, there could be two or more inductivecoils formed within the first and/or second conductive patterns 18,20.Further, the conductive patterns 18,20 need not form an inductive coil26 but, for instance, could establish an inductive reactance from theformation of an electrical transmission line constructed by strip lineor microstrip methods and be within the spirit and scope of theinvention.

The resonant circuit of tag 10 further includes a capacitive elementhaving a first plate formed by a first generally rectangular landportion 28 of the first conductive pattern 18, as shown in FIG. 1, and asecond plate formed by a second generally rectangular land portion 30 ofthe second conductive pattern 20 as shown in FIG. 2. The conductive landportions or plates 28, 30 are aligned so as to overly each other and areseparated by the dielectric substrate 12 to form the capacitive element.

Referring now to FIGS. 1 and 2 the resonant circuit 11 is formed by thecombination, in a series loop, of the inductive coil 26 electricallyconnected on one end to the generally rectangular land portion 28 of thefirst conductive pattern 18 and on the other end to the generallyaligned rectangular land portion 30 of the second conductive pattern 20,by a link (not shown) which passes through the dielectric substrate 12to electrically connect the conductive patterns 18,20. Although theillustrated embodiment of the tag 10 includes a single capacitor formedby the land portions 28, 30, two or more capacitor elements couldalternately be employed and still be within the spirit and scope of theinvention.

The tag 10 as thus far described is typical of prior art security tagswhich are well known in the electronic security and surveillance art andhave been in general usage. In forming such security tags, the area ofthe inductive coil 26 and the areas of the overlap of the capacitorplates 28, 30 are carefully selected so that the resonant circuit 11formed thereby has a predetermined resonant frequency which generallycorresponds to or approximates a detection frequency employed in anelectronic article security system for which the tag 10 is designed tobe employed. In the illustrated embodiment, the tag 10 resonates at ornear 8.2 megahertz (MHz) which is a frequency commonly employed byelectronic article security systems from a number of manufacturers.However, this specific frequency is not to be considered a limitation ofthe present invention.

The resonant frequency tag 10 as shown and described is generallyadequate for its intended purposes. However, because of themanufacturing techniques used for making the tag 10, it is not unusualfor the resonant frequency of at least a portion of the tags which areproduced to vary from the desired resonant frequency. Such variations inthe resonant frequency of a tag 10 may be due to variations in thethickness of the dielectric between the two capacitor plates 28, 30,slight misalignments in the capacitor plates, 28, 30 and other factors.As a result, in order to make sure that any tag 10 having a resonantfrequency at or near the desired resonant frequency is detected whenpassing through the surveillance zone of a detection system, it isnecessary to vary the frequency employed by the detection system atleast within a prescribed range both above and below the desiredresonant frequency. For example, if the desired resonant frequency is8.2 MHz, the detection system must be operational for frequenciesbetween about 7.6 MHz and about 9.0 MHz. Producing detection systemswhich function within such a detection frequency range is less efficientthan detection systems which operate in a much smaller detectionfrequency range.

The present invention overcomes the problems associated with suchvariations in the resonant frequency of the prior art resonant frequencytag 10 by employing a different manufacturing process or method to moreprecisely control the positioning of the second capacitor plate relativeto the first capacitor plate to thereby more tightly control thecapacitance of the capacitor and to thereby more tightly control theresonant frequency of the tag. FIG. 3 is a schematic representation of aresonant frequency tag 110 in accordance with a preferred embodiment ofthe present invention. The resonant frequency tag 110, like the tag 10as described above, includes at least one inductive component and atleast one capacitive component connected in parallel to form a resonantcircuit having substantially the same characteristics as the resonantcircuit 11 as described above.

Like the tag 10 of FIGS. 1 and 2, the tag 110 of FIG. 3 is formed by acombination of a first conductive pattern 118 and a second conductivepattern 120 with a dielectric therebetween. The first conductive pattern118 may be formed using a subtractive process (i.e., etching) asdescribed above in connection with tag 10 by die cutting, an additive orconductive ink process or any other suitable technique. As with theprior art tag 10 the conductive material employed in forming both thefirst and second conductive patterns 118, 120 is preferably aluminum.However, other conductive materials could alternatively be employed. Aswith the prior art tag 10, the first conductive pattern 118 is comprisedof an inductive coil 126 and a first capacitor plate formed by part of afirst conductive land 128. As best shown in FIG. 3, the land 128includes a first or proximal end 128 a which is electrically connectedto one end of the inductive coil 126 and a second or distal end 128 b.The first and second ends 128 a and 128 b of land 128 are separated by apredetermined distance which establishes the length of the land 128. Inthe illustrated embodiment, the land 128 further includes first andsecond lateral sides 128 c and 128 d extending between the first andsecond ends 128 a and 128b. The first side 128 c is generally straightand generally parallel to a portion of the inductive coil 126. Thesecond side 128 d extends at an angle so as to not be parallel to thefirst side 128 c. In this manner, the width of the land 128 (i.e. thedistance between the first and second sides 128 c, 128 d) decreases ortapers when moving along the length from the first end 128 a to thesecond end 128 b. In all other respects, the first conductive pattern118 is substantially the same as the first conductive pattern 18 of theabove-described prior art tag 10. Preferably, the first conductivepattern is at least initially supported by a carrier sheet 113 which maybe paper or the like.

A second principal distinction between the present tag 110 and the priorart tag 10 lies in the structure of the second conductive pattern 120and the manner in which the second conductive pattern 120 is secured tothe first conductive pattern 118. As best shown in FIG. 3, the secondconductive pattern 120 comprises a generally symmetrical and preferablyrectangularly shaped second conductive land 130 a portion of which formsthe second capacitor plate. The land 130 is generally rectangular andsymmetrical including generally parallel first and second lateral sides130 a and 130 b and generally parallel first and second ends 130 c and130 d. The first end 130 c is electrically connected to a generallyelongated conductive link 132 which terminates in a further generallyrectangular conductive land 134. Unlike the prior art tag 10, the secondconductive pattern 120 of the present embodiment is preferably formedseparately and apart from the first conductive pattern 118. The secondconductive pattern 120 may be formed using a subtractive or etchingprocess, an additive or conductive ink process, a die cut process or inany other manner which is known or becomes known to those of ordinaryskill in the art. The second conductive pattern 120 may include adielectric layer (not shown) or, if desired, a separate dielectric layeror film may be placed between the second conductive pattern 120 and thefirst conductive pattern 118 before they are secured together.Alternatively, the first conductive pattern 118 may include a dielectriclayer, at least in the area of the first conductive land 128.

Once the second conductive pattern 120 has been separately formed, it iscarried on a carrier sheet or substrate 216 (shown on FIG. 4) so that itcan be placed on the first conductive pattern 118 at a location suchthat at least a portion of the second land 130 overlies at least aportion of the first land 128 (with the dielectric therebetween), theoverlying portions establishing capacitor plates to form a capacitorhaving the correct capacitance for establishing a resonant circuithaving a frequency which is the precise predetermined resonant frequencyor is within a very tight tolerance of the predetermined resonantfrequency. Preferably, when the second conductive pattern 120 is locatedat the correct position with the second land 130 overlying at least aportion of the first land 128 to form the correct capacitance, thesecond conductive pattern 120 is secured to the first conductive pattern118 using an adhesive (which may be the dielectric layer), hot pressing(heat and pressure) or some other suitable technique. As will beappreciated when viewing FIG. 3, the area of overlap of land 128 andland 130 may be altered, preferably before the second conductive pattern120 is secured to the first conductive pattern 118 by simply moving orsliding the second land 130 (second conductive pattern 120) along thelength of the first land 128 generally parallel to the first side 128 c.Moving land 130 toward the second end 128 b of land 128 decreases thearea of overlap of lands 128, 130 to thereby effectively decrease thesize of the capacitor plates and the capacitance of the resultingcapacitive element. Correspondingly, moving land 130 toward the firstend 128 a of land 128 increases the area of overlap between the twolands 128, 130 to thereby effectively increase the size of the capacitorplates and the capacitance of the capacitive element. As is well knownto those of ordinary skill in the art, the resonant frequency of aresonant circuit is established by the value of the inductance and thevalue of the capacitance in accordance with a predetermined formula$F = \frac{1}{2\pi\sqrt{L \cdot {C.}}}$Increasing the capacitance of a resonant circuit while keeping theinductance constant decreases the frequency and decreasing thecapacitance while keeping the inductance constant increases the resonantfrequency. By precisely selecting the bonding location of the secondconductive pattern 120 on the first conductive pattern 118, the resonantfrequency of the resonant circuit may be precisely controlled or tunedto correspond to a predetermined target resonant frequency within a verytight tolerance.

Once the position of the second conductive pattern 120 has beenestablished and the second conductive pattern 120 has been secured tothe first conductive pattern 118, the resonant circuit is completed byestablishing a conductive link (not shown), typically referred to as aweld through, which passed through the dielectric to electricallyconnect together the conductive land 134 on the distal end of the secondconductive pattern 120 with the coil 126 of the first conductive pattern118. The establishment of the link through the dielectric effectivelyconnects the inductance and capacitance in parallel thereby completingthe resonant circuit. The frequency of the resonant circuit can bedetermined utilizing suitable test equipment well known to those ofordinary skill in the art. If the resonant frequency of the tag 110corresponds to the predetermined or desired resonant frequency, within apredetermined tolerance, then no further action need be taken. If thefrequency of the resonant circuit does not correspond to thepredetermined resonant frequency, then the capacitance of the resonantcircuit must be adjusted either upwardly or downwardly. Since it may bedifficult if not impossible to effectively remove the second conductivepattern 120 from the first conductive pattern 118, the position of thesecond conductive pattern 120 may be adjusted accordingly for asubsequent tag 110 being produced during a manufacturing process.Eventually, by carefully adjusting the position of the second conductivepattern 120 on the first conductive pattern 118 of subsequently producedtags, the resonant frequency of such subsequently produced tags may beadjusted upwardly or downwardly until the resonant frequency is at thepredetermined frequency within the prescribed tolerance. In this manner,the resonant frequency of a tag 110 may be “tuned” to match thepredetermined desired resonant frequency.

FIG. 5 is a fragmentary view of a portion of a tag 310 in accordancewith an alternate embodiment of the present invention. The tag 310includes a first conductive pattern which includes an inductive elementor inductor coil 326 with a land 328 connected to the distal end of thecoil 326. However, unlike the land 128 as described above in connectionwith FIG. 3, the land 328 in connection with the present embodiment isgenerally rectangularly shaped. More particularly, the land 328 inconnection with the present embodiment includes a first end 328 a whichis generally parallel and spaced apart from a second end 328 b. The land328 further includes generally parallel lateral sides 328 c and 328 d.Thus, unlike the land 128 as shown in FIG. 3, the width of land 328 doesnot change when moving along the length of land 328 between ends 328 aand 328 b.

The present embodiment further includes a second conductive pattern 320which is precisely the same as the second conductive pattern 120 asshown in FIG. 3. In particular, and as shown in FIG. 5, the secondconductive pattern 320 includes a generally rectangularly shaped land330, the first end of which is electrically connected to a generallyelongated conductive link 332. As with the embodiment described above inconnection with FIG. 3, the capacitance of the resonant frequency tag310 is established by the degree to which the land 330 of the secondconductive pattern overlies the land 328 of the first conductive patternwith the dielectric therebetween. FIG. 5 illustrates a situation inwhich a portion (approximately one half) of the width of land 330overlies land 328 to provide a certain capacitance. In order to decreasethe value of the capacitance, land 338 may be moved further away fromthe first end 328 a of land 328 to thereby decrease the area in whichland 330 overlies land 328. In order to increase the capacitance, land330 may be moved toward the first end 328 a of land 328 to therebyincrease the area by which land 330 overlies land 328.

FIG. 4 illustrates a preferred system configuration for implementing amethod of manufacturing resonant frequency tags in accordance with thepresent invention. The completed tags 110 are structurally the same asthe tag 110 described above in connection with FIG. 3 and are securedtogether along opposite edges in a sequential series or web 200 forpurposes of illustrating the present invention. In the web 200, whichmay be formed by a continuous carrier sheet 113, each of the partiallycompleted tags 110 are oriented with the first conductive pattern 118facing upwardly. As part of the manufacturing process, the web 200 ofpartially completed tags is moved from the left toward the right in astepwise or indexed manner as illustrated by the flow arrows. Movementof the web 200 of partially completed tags is controlled by a driveroller 210 which is driven to index for a predetermined distance by adrive mechanism comprised of an electric motor 212 and suitable drivemembers 214. Other drive mechanisms may alternately be employed. Inaddition, in some applications, the second conductive pattern 120 may beapplied to the first conductive pattern 118 after the partiallycompleted tag 110 has been applied to an associated product. Forexample, it is known in the art that some items, particularly items witha high metal content, may change the frequency of an applied resonantfrequency tag. By applying a partially completed tag 110 to the item andthereafter applying the second conductive pattern 120, any frequencyshift caused by the item to which the tag 110 is attached can becompensated for by adjusting the position of the second conductivepattern 120 to adjust the resonant frequency of the completed tag 110 tobe at the predetermined, desired frequency.

A first supply roll 214 includes a plurality of previously formed secondconductive patterns 120 which are spaced apart a predetermined distanceon the downwardly facing side of a-supporting substrate such as releasepaper 216. The second conductive patterns 120, which may include adielectric layer with heat seal properties, are positioned on therelease paper 216 such that as the release paper 216 is removed from thesupply roll 214, the second conductive patterns 120 are aligned with thefirst conductive patterns 118 of the web 200 in the manner describedabove in connection with the tag of FIG. 3. A pair of idler rollers 218,220 and a take up roll 222 assist in establishing the proper orientationof the second conductive patterns 120 with respect to the firstconductive patterns 118 of the partially completed tags of the web 200.A pressing mechanism 224, of a type well known to those skilled in theart, is positioned between the two idler rollers 218, 220 for pressingone of the second conductive patterns 120 into engagement with each ofthe partially completed tags 110 of the web 200. The pressing mechanism224 may employ pressure, heat or a combination of heat and pressure forsecuring or bonding the second conductive patterns 120 to the firstconductive patterns 118 of the partially completed tags 110.

As shown, once the tags of the web 200 pass beyond the second idlerroller 220, each completed tag 110 of the web 200 includes a secondconductive pattern 120 which has been secured so that at least a portionof the second land 130 of the second conductive pattern 120 overlies aportion of the first land 128 of the first conductive pattern 118 toestablish a capacitance for the resonant circuit as described above. Asthe web 200 of completed tags 110 moves further toward the right, eachof the tags passes through a welding mechanism 226 which creates thelink which passes through the dielectric to electrically connecttogether the inductive portion 126 of the first conductive pattern 118and the land 134 of the second conductive pattern 120 to therebycomplete the resonant circuit. The welding mechanism 226 is of a typewell known to those of ordinary skill in the art. Yet further along theproduction line, the resonant frequency of each of the tags 110 of theweb 200 is measured utilizing a suitable probe 228 and frequencydetermining equipment 230 which are both also of a type well known tothose of ordinary skill in the art. In effect, the probe 228sequentially subjects each resonant frequency tag of the web 200 to aseries of frequencies which are close to (above and below) thepredetermined resonant frequency and then “listens” to see whether thetag 110 resonates at a particular frequency in a pulse/listen mannerwhich is well known in the art. Once the precise frequency of eachresonant frequency tag 110 is determined, the frequency information issent from the frequency determining equipment 230 to a controller 232which compares the resonant frequency as measured for each tag 110 withthe desired or predetermined resonant frequency. If the resonantfrequency of the tag 110 matches the predetermined resonant frequencywithin a prescribed small tolerance (for example, 100 KHz), then themanufacturing process is permitted to continue in the same manner withthe subsequent second conductive patterns 120 being secured tosucceeding tags 110 in the same position as the prior tag to maintainthe same capacitance and thus the same frequency. On the other hand, ifthe controller 232 determines that the measured resonant frequency doesnot match the predetermined frequency within the prescribed tolerance,then the position of the second conductive pattern 120 on subsequenttags is adjusted to either increase the capacitance or decreased thecapacitance of subsequent tags 110 depending upon the result of thecomparison. In the embodiment as illustrated in FIG. 4, the position ofthe second conductive pattern 120 may be adjusted by adjusting theindexing of the web 200 by increasing or decreasing the time of theactuation of the electric motor 212 to thereby change the location ofthe first conductive pattern 118 of each partially completed tag 110relative to the pressing mechanism 224 and second conductive pattern120. Decreasing the time of the actuation of the electric motor 212effectively moves the position of the second conductive pattern 120 tobe closer to the second end 228 b of conductive land 128 of the tags 110to thereby decrease the capacitance of the resulting resonant circuit.Increasing the time of the actuation of the electric motor 212effectively moves the position of the second conductive pattern 120toward the first end 128 a of conductive land 128 to effectivelyincrease the capacitance of the resulting resonant circuit. By utilizingthe above-described process, the position of the second conductivepattern 220 will promptly be in the correct location for subsequent tags110 along the web 200 so that the frequency of subsequently producedtags 110 will continue to match the predetermined resonant frequencywithin the prescribed tolerance.

It should be understood by those of ordinary skill in the art that themanufacturing process disclosed in FIG. 4 is but one embodimentimplementing the present invention. If desired, the frequency measuringstation 228, 230 could be located prior to the welding mechanism 226 orcould be integrated as part of the pressing mechanism 224. For example,the pressing mechanism 224 could include non-metallic plates (not shown)for engaging and pressing together the first conductive pattern 118 andsecond conductive pattern 120 with a probe that measures the frequencyof a tag 110 as the second conductive pattern 120 and the firstconductive pattern 118 are being pressed together but before the secondconductive pattern 120 is actually secured to the first conductivepattern 118. While the frequency reading thus obtained will not be thesame as it would for a completed tag 110, a relationship exists betweenthe read frequency and the final frequency of the completed tag 110which enables an adjustment to be made to the position of the secondconductive pattern 120 in order to have the completed tag 110 resonateat the desired frequency. Suitable feedback may be provided to controlthe position of the second conductive pattern 120. This method isillustrated by the flow diagram of FIG. 7 and the diagram of FIG. 8.Referring to FIG. 8, it can be seen that a measured frequency within thetarget range when the second conductive pattern 120 is separated fromthe first conductive pattern 118 by the dielectric thickness and anadditional air gap, results in a completed tag (i.e., with the secondconductive pattern 120 engaging the dielectric) with a frequency whichcorresponds to the desired frequency within the prescribed tolerance.

As can be appreciated from FIG. 8, the capacitance of a tag may also bechanged, at least slightly, by varying the pressure applied by thepressing mechanism 224. For example, applying additional pressureeffectively decreases the separation between the capacitor plates tothereby increase capacitance and decreasing the pressure effectivelyincreases the distance between the capacitor plates to decreasecapacitance. Control of the pressure applied by the pressing mechanism224 may be accomplished by the controller 232 based upon the frequencyreading obtained by the frequency measuring station 228, 230.Alternatively, the pressing mechanism 224 could include its ownfrequency measuring equipment to provide for immediate feedback for realtime controlling of the pressure applied by the pressing mechanism 224.Other techniques or equipment for controlling the amount of pressureapplied to the second conductive pattern 120 will be apparent to thoseof ordinary skill in the art. Controlling the pressure applied by thepressing mechanism 224 can thus be used as a way of fine tuning theresonant frequency of each tag. Other variations in the manufacturingprocess will be apparent those of ordinary skill in the art.

In addition to providing a method for making resonant frequency tagswhich resonate at a predetermined frequency or within a small toleranceof a predetermined frequency, the present invention comprises a methodof making a series of individually unique resonant frequency tags, eachof which resonates at a different frequency within a frequency range. Ascan clearly be understood by the foregoing description, the frequency ofa resonant frequency tag is an inverse function of the capacitance andthe inductance of the tag and is established by the formula set forthabove. As also described above, in the resonant frequency tag shown onFIG. 3, the inductance is constant and is determined by the size andother characteristics of the inductive coil 126 of the first conductivepattern 118. The frequency of the tag 110 of FIG. 3 is thus determinedby the capacitance of the tag which is established by the location ofthe second conductive pattern 120 and, more particularly, the portion ofthe conductive land 128 which is overlaid by the conductive land 130 toestablish the capacitance of the capacitive element. The more the secondconductive pattern 120 and, particularly conductive land 130 movestoward the first end 128 a of the first conductive land 128, the greaterthe capacitance of the resonant frequency circuit and, thus, the lowerthe frequency and vice versa.

In some applications, rather than having a series of resonant frequencytags which all resonant at the same or at nearly the same frequency, itis desirable to have a series of resonant frequency tags, each of whichresonates at a frequency which is different from the resonant frequencyof every other tag in the series. Such a series of tags, all havingdifferent frequencies, can be useful in radio frequency identification(RFID) by associating a resonant frequency tag having a particular knownfrequency with a particular item. Thus, by detecting a tag having aparticular resonant frequency, the presence of the item associated withthe tag having the particular frequency may also be detected.

In accordance with the present invention, a series of N resonantfrequency tags (N being an integer greater than 1) may be made by merelyvarying the position of the second conductive pattern 130 on each tag asdescribed above. Thus, for example, a first resonant frequency taghaving a first resonant frequency may be established by locating thesecond conductive pattern 130 proximate to the first end 128 a of theconductive land 128, a second resonant frequency tag having a secondresonant frequency may be made by positioning the second conductivepattern 130 a little bit closer to the second end 128 b of the firstconductive land, etc. By moving the second conductive pattern 130 byonly a small distance along the length of the first conductive land 128an entire series of N resonant frequency tags may be made. For example,by employing the above-described techniques it is possible to make aseries of about 2,800 resonant frequency tags within the frequency rangeof 2 to 30 MHz with the resonant frequency of each tag of the seriesdiffering from the resonant frequency of each of the other resonantfrequency tags of the series by a frequency range of at least 10 kHz.

Making a series of resonant frequency tags with each tag having adifferent resonant frequency may be accomplished in the same manner andusing the same techniques as described above in connection with FIG. 4.However, unlike FIG. 4 in which the described goal is to produce tagshaving the same frequency, the equipment disclosed and described isoperated to create resonant frequency tags having different frequenciesby adjusting the time of actuation of the electric motor 212 to changethe position of the placement of the second conductive patterns 120relative to the first conductive patter 118 for each tag accordingly.

FIG. 6 is a perspective view of a second conductive pattern 620 inaccordance with a further embodiment of the present invention. Thesecond conductive pattern 620 is essentially the same as the secondconductive pattern 120 as described above and shown in connection withFIGS. 3 and 4. In particular, the second conductive pattern 620 includesa generally rectangularly shaped second conductive land 630 the firstend of which is connected to a generally elongated conductive linkformed of two sections 632 a and 632 b which are spaced apart by a gap632 c of a predetermined minimum width. The second section 632 b of theconductive link in turn is connected to a further generally rectangularconductive land 634. The second conductive pattern 620 may be formedusing a subtractive or etching process, an additive process such asconductive ink, a die cut process or in any other manner which is knownor becomes known to those of ordinary skill in the art. The secondconductive pattern 620 may include a dielectric layer.

The second conductive pattern 620 further includes an integrated circuit650 which is preferably secured to one of the first and second sections632 a, 632 b of the link element. The integrated circuit 650 which is ofa type well known to those of ordinary skill in the art includes atleast two electrical leads with a first electrical lead 652 beingelectrically connected to the first link element section 632 a and thesecond lead 654 being electrically connected to the second link elementsection 632 b. By incorporating an integrated circuit 650 in thismanner, a resonant frequency tag made in accordance with any of theabove-described methods may be employed as a radio frequencyidentification (RFID) tag of the type which includes a memory chip forstoring identification information. The resonant circuit thus acts as anantenna and power source for the integrated circuit 650 for radiating aradio frequency signal determined by the data stored within the memoryof the integrated circuit.

It will be appreciated by those skilled in the art that changes could bemade to the embodiments described above without departing from the broadinventive concept thereof. It is understood, therefore, that thisinvention is not limited to the particular embodiments disclosed, but itis intended to cover modifications within the spirit and scope of thepresent invention as defined by the appended claims.

1-24. (cancelled)
 25. A method of making a resonant frequency tag whichresonates at a predetermined frequency, the method comprising the stepsof: (a) forming a first conductive pattern comprising an inductiveelement and a first land, the first land having a first end connected toone end of the inductive element, and a second end spaced apredetermined distance from the first end; (b) separately forming asecond conductive pattern comprising a second land and a link element,the second land having a predetermined width; (c) placing the secondconductive pattern proximate to the first conductive pattern at a firstpredetermined location so that the second land overlies at least aportion of the first land with a dielectric therebetween to establishthe plates of a capacitive element with a first predeterminedcapacitance which with the inductive element forms a resonant circuit;(d) measuring the resonant frequency of the resonant circuit andcomparing the measured frequency with the predetermined frequency; and(e) if the resonant frequency does not match the predetermined frequencywithin a selected tolerance, moving the second conductive pattern sothat the second land moves along the length of the first land to therebychange the capacitance of the capacitive element;
 26. The method ofclaim 25 further comprising the steps of: (f) repeating steps (d) and(e) until a match occurs; and (g) securing the second conductive patternto the first conductive pattern.
 27. The method as recited in claim 25,wherein the first land has a width which decreases when moving along thelength from one end to the other end.
 28. The method as recited in claim27, wherein the second land is generally rectangular and has a lengthwhich exceeds the greatest width of the first land.
 29. The method asrecited in claim 25, wherein the second conductive pattern is secured tothe first conductive pattern by one of an adhesive and hot pressing. 30.The method as recited in claim 29, wherein the second conductive patternis secured to the first conductive pattern by applying pressure, theamount of applied pressure being varied to control the resonantfrequency of the tag.
 31. The method as recited in claim 25, wherein thesecond conductive pattern, once formed, is initially held on a carriersheet.
 32. The method as recited in claim 25, wherein the secondconductive pattern includes a dielectric layer which is placed betweenthe second land and the first land prior to securing the secondconductive pattern to the first conductive pattern.
 33. The method asrecited in claim 25, wherein the link element comprises a first sectionconnected to the second land and a section send, the first and secondsections of the link element being spaced apart by a gap of apredetermined minimum width further comprising an integrated circuitincluding at least a first lead electrically connected to the firstsection of the link element and a second lead electrically connected tothe second section of the link element.
 34. The method as recited inclaim 33, wherein the integrated circuit is secured to one of the firstand second section of the link element.
 35. The method as recited inclaim 26, wherein the first land has a width which decreases when movingalong the length from one end to the other end.
 36. The method asrecited in claim 35, wherein the second land is generally rectangularand has a length which exceeds the greatest width of the first land. 37.The method as recited in claim 26, wherein the second conductive patternis secured to the first conductive pattern by one of an adhesive and hotpressing.
 38. The method as recited in claim 37, wherein the secondconductive pattern is secured to the first conductive pattern byapplying pressure, the amount of applied pressure being varied tocontrol the resonant frequency of the tag.
 39. The method as recited inclaim 26, wherein the second conductive pattern, once formed, isinitially held on a carrier sheet.
 40. The method as recited in claim26, wherein the second conductive pattern includes a dielectric layerwhich is placed between the second land and the first land prior tosecuring the second conductive pattern to the first conductive pattern.41. The method as recited in claim 26, wherein the link elementcomprises a first section connected to the second land and a sectionsend, the first and second sections of the link element being spacedapart by a gap of a predetermined minimum width further comprising anintegrated circuit including at least a first lead electricallyconnected to the first section of the link element and a second leadelectrically connected to the second section of the link element. 42.The method as recited in claim 41, wherein the integrated circuit issecured to one of the first and second section of the link element.